?2007 Microchip Technology Inc.
DS21483D-page 19
TC9400/9401/9402
14-Lead Ceramic Dual In-Line (JD) .300" Body [CERDIP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. ?Significant Characteristic.
3. Dimensioning and tolerancing per ASME Y14.5M.
BSC:Basic Dimension. Theoretically exact value shown without tolerances.
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
INCHES
Dimension Limits MIN
NOM
MAX
Number of Pins
N
14
Pitch
e
.100 BSC
Top to Seating Plane
A
.200
Standoff ?/DIV>
A1 .015
Ceramic Package Height
A2 .140
.175
Shoulder to Shoulder Width
E .290
.325
Ceramic Package Width
E1 .230
.288
.300
Overall Length
D .740
.760
.780
Tip to Seating Plane
L .125
.200
Lead Thickness
c .008
.015
Upper Lead Width
b1 .045
.065
Lower Lead Width
b .015
.023
Overall Row Spacing
E2 .320
.410
N
E1
D
1 2
NOTE 1
A
A1
b1
b
e
L
A2
E
c
E2
MicrochipTechnologyDrawingC04-002B
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